🪚 Fibreglass and board dust
caution
Where you meet it: Cutting, shearing or sawing circuit boards, especially trimming gold fingers
What you need to know
- Epoxy-fibreglass dust is a mechanical respiratory and skin irritant, and it carries lead and metal residue with it.
- Wet-cut, or run a shop-vac right at the blade. P100 respirator. Outdoors if you can.
- Never grind or sand gold fingers off — you aerosolise the gold you're trying to keep, along with the glass.
The rule: NEVER dry-cut boards indoors without extraction.
Components this applies to
Gold fingers (trimmed)
Au 2.0–3.0 g/lbBase Cu
S
Noble Thermocouple Wire (Type R/S/B)
Pt ~410 g per lb of bare noble wireBase Rh 6–30% of one legBase Type K/J/T/E/N: zero PGM
S
Pogo Pins & Spring-Loaded Test Probes
Au 1.4–3.0 g/lbCu ~330 g/lbBase steel springs
S
Precious-Metal Sputtering Targets
Au ~454 g/lb — the target is solid metalPt 138 g in a 2 in × 0.125 in discPd 77 g in a 2 in × 0.125 in disc
S
Silver-Graphite Brushes & Slip Rings
Ag 40–95% by weightCu pigtail + commutator segmentsBase electrographite
S
IBM Multi-Chip / Thermal Conduction Modules
Au 1–5 g per module ≈ 0.3–0.7 g/lbCu ~48 g/lbBase Mo internal wiring
B
Silver-Plated Copper Wire & Coax
Ag 2.8–6.8 g/lb as-received; 5.7–11.3 g/lb stripped conductorCu ~230 g/lbBase 40–55% PTFE/FEP
B
Card-Edge Receptacles & Sockets
Au 0.15–0.50 g/lb for genuine gold-contact socketsCu ~130 g/lbBase 55–70% PBT/LCP/nylon
C
Ceramic disc capacitors
Ag 4–10 g/lbPd 0.05–0.3 g/lb
C
DC-DC converter bricks & isolation modules
Au 0.08–0.3 g/lbAg 1–4 g/lbCu ~90 g/lb
C
Metal oxide varistors (MOVs)
Ag 6–14 g/lb
C
Silver mica capacitors
Ag 10–20 g/lbCu ~60 g/lb
C
Thick-film resistor networks (SIP/DIP)
Ag 2–5 g/lbPd 0.2–0.7 g/lb
C
Bridge rectifiers and power diodes
Cu 140–240 g/lbAg 0.5–2 g/lbAu ~0.02 g/lb
D
Carbon and metal film resistors
Cu ~15 g/lb
D
Ceramic HRC fuses (and glass fuses)
Ag 1–3 g/lbCu ~90 g/lb
D
Chip antennas (LTCC ceramic)
Ag 6–18 g/lb
D
Clip-on and bolt-on board heatsinks
Cu 0–450 g/lb
D
Console Game Cartridges
Au 0.003–0.015 g per cartridge ≈ 0.04 g/lb wholeAu 0.6–0.9 g/lb of trimmed fingersCu negligible
D
EMI shield cans and fences
Cu 150–290 g/lb
D
Gold-Plated Flex Circuits (FFC/FPC/ZIF)
Au 0.05–0.15 g/lb of cableCu ~100 g/lbBase 60–80% polyimide/PET + acrylic
D
Laser Printer Boards, Fusers & Toner Chips
Au 0.01–0.04 g per formatter board ≈ 0.045 g/lbAu 0.0005–0.002 g per toner CRUM chip ≈ 0.3–0.8 g/lb of chipsBase Fuser: no precious metal whatsoever
D
LEDs (through-hole and power SMD)
Au 0.02–0.08 g/lbAg 2–7 g/lbCu ~100 g/lb
D
RJ45 Jacks with Integrated Magnetics
Au 0.02–0.07 g/lbCu ~57 g/lbBase ferrite
D
Tape Drives & Libraries (LTO/DLT/DAT)
Au 0.05–0.20 g per LTO drive ≈ 0.03 g/lbCu ~10 g/lbBase 0.7–1.8 kg aluminium per full-height drive
D
Thermal Printheads
Au 0.002–0.02 g per head ≈ 0.06 g/lbBase Ru as RuO2 glazeBase alumina substrate + Al heatsink bar
D
Thermistors (NTC/PTC) and piezo elements
Ag 2–5 g/lb
D
Transformers, inductors, chokes & toroids
Cu 100–220 g/lb
D