Gold-plated SMD (SAW filters, RF modules, shields)

Colour stability. Real gold plating is a warm even yellow that doesn't tarnish, dull or grey with age. On a twenty-year-old board, whatever still looks freshly yellow is gold. Tin looks pale grey-white; brass goes brown or green; old solder is dull.

Au 0.5–1.5 g/lbAg 0.2–1 g/lb

eBay typical$40–90per lb

Refiner pays$25per lb

Metal in it$118per lb at 4 Aug 2026 spot

Confidencelowof the yield figures

How to spot it

Gold-lidded SAW filters and RF modules (small metal-lid rectangles on phone and RF boards), gold-terminated ceramic packages, gold-plated resistor networks and MELF on mil boards, gold-plated shield cans, gold pad and via fields.

Metal content

Metal	Quantity	Notes
Gold	0.5–1.5 g/lb	thin plating, needs volume
Silver	0.2–1 g/lb

At 4 Aug 2026 spot prices that works out to $118 per pound of contained metal — Gold 0.9 g = $117, Silver 0.5 g = $0.95. A refiner paying $25 returns about 21% of that, which is normal: refining costs money and the buyer takes a margin.

Safe removal

Working temperature: Preheat 250–280 °C / hot air 330–370 °C

Preheat plate 250–280 °C and scrape into a pan, or hot air 330–370 °C for selective picking.

Hazards

☠ Lead — dust more than fume

NEVER dry sweep or use compressed air on a scrapping bench. HEPA-vac or wet-wipe only.

💨 Fumes, ventilation and open flame

NEVER burn boards, wire insulation or plastic. Ever.

Questions

How much gold is in gold-plated smd (saw filters, rf modules, shields)?

Gold: 0.5–1.5 g/lb. Silver: 0.2–1 g/lb. At current spot that is about $118 of contained metal per pound.

How do you identify gold-plated smd (saw filters, rf modules, shields)?

Colour stability. Real gold plating is a warm even yellow that doesn't tarnish, dull or grey with age. On a twenty-year-old board, whatever still looks freshly yellow is gold. Tin looks pale grey-white; brass goes brown or green; old solder is dull.

How do you remove gold-plated smd (saw filters, rf modules, shields) safely?

Preheat plate 250–280 °C and scrape into a pan, or hot air 330–370 °C for selective picking.

Related in ICs & chips

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