BGA with gold tab / gold-corner BGA

Visible gold plating around the substrate perimeter — the trade calls these 'gold corner' BGAs. Large chips on high-end boards: northbridge, southbridge, GPU dies, network ASICs, FPGAs. A BGA with no gold tab pays $2/lb versus $42/lb, a 20× difference for the same shape.

Au 1.0–2.0 g/lbAg 0.3–1 g/lb

eBay typical$60–110per lb

Refiner pays$42per lb

Metal in it$197per lb at 4 Aug 2026 spot

Confidencemedof the yield figures

How to spot it

Square package with a solder ball array underneath and an organic or ceramic substrate. Check the exposed substrate edge and corners for yellow.

Metal content

Metal	Quantity	Notes
Gold	1.0–2.0 g/lb	substrate perimeter plating + pads + wire
Silver	0.3–1 g/lb

At 4 Aug 2026 spot prices that works out to $197 per pound of contained metal — Gold 1.5 g = $196, Silver 0.6 g = $1.14. A refiner paying $42 returns about 21% of that, which is normal: refining costs money and the buyer takes a margin.

Safe removal

Working temperature: Hot air 380–420 °C + bottom preheat 150–200 °C

Board preheat 150–200 °C from underneath, top hot air 380–420 °C at medium airflow, lift straight up with a vacuum pen or tweezers when the part floats.

Hazards

☠ Lead — dust more than fume

NEVER dry sweep or use compressed air on a scrapping bench. HEPA-vac or wet-wipe only.

💨 Fumes, ventilation and open flame

NEVER burn boards, wire insulation or plastic. Ever.

Questions

How much gold is in bga with gold tab / gold-corner bga?

Gold: 1.0–2.0 g/lb. Silver: 0.3–1 g/lb. At current spot that is about $197 of contained metal per pound.

How do you identify bga with gold tab / gold-corner bga?

Visible gold plating around the substrate perimeter — the trade calls these 'gold corner' BGAs. Large chips on high-end boards: northbridge, southbridge, GPU dies, network ASICs, FPGAs. A BGA with no gold tab pays $2/lb versus $42/lb, a 20× difference for the same shape.

How do you remove bga with gold tab / gold-corner bga safely?

Board preheat 150–200 °C from underneath, top hot air 380–420 °C at medium airflow, lift straight up with a vacuum pen or tweezers when the part floats.

Related in ICs & chips

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