MICROSCRAPPINGE-waste field guide
Purple CERDIP32 × 15 mm
Ceramic EPROM32 × 15 mm
Black top ceramic20 × 7 mm

Drawn to true relative scale — the variants above are directly size-comparable.

ICs & chips · Tier A

Ceramic IC — gold legs OR gold lid (not both)

Ceramic body, but only one of the two gold features. Gold legs with a plain lid pays more than a gold lid with tin legs — legs are more metal than lid plating.

Au 1.0–2.5 g/lbAg 0.5–2 g/lb
eBay typical$200–400per lb
Refiner pays$150per lb
Metal in it$224per lb at 4 Aug 2026 spot
Confidencemedof the yield figures

How to spot it

Purple-brown CERDIP with a glass frit seal line around the middle, black-top ceramic DIPs, ceramic EPROMs with the quartz window.

Metal content

MetalQuantityNotes
Gold1.0–2.5 g/lbpins + bond wire + cavity plating
Silver0.5–2 g/lb

At 4 Aug 2026 spot prices that works out to $224 per pound of contained metal — Gold 1.7 g = $222, Silver 1 g = $1.90. A refiner paying $150 returns about 67% of that, which is normal: refining costs money and the buyer takes a margin.

Safe removal

Working temperature: Preheat 250–280 °C

Preheat 250–280 °C, pull with pliers.

Hazards

☠ Lead — dust more than fume

NEVER dry sweep or use compressed air on a scrapping bench. HEPA-vac or wet-wipe only.

Before you scrap it

Windowed ceramic EPROMs (2716, 27C256) sell to the retro market.

Questions

How much gold is in ceramic ic — gold legs or gold lid (not both)?

Gold: 1.0–2.5 g/lb. Silver: 0.5–2 g/lb. At current spot that is about $224 of contained metal per pound.

How do you identify ceramic ic — gold legs or gold lid (not both)?

Ceramic body, but only one of the two gold features. Gold legs with a plain lid pays more than a gold lid with tin legs — legs are more metal than lid plating.

How do you remove ceramic ic — gold legs or gold lid (not both) safely?

Preheat 250–280 °C, pull with pliers.

Is ceramic ic — gold legs or gold lid (not both) worth more working than as scrap?

Windowed ceramic EPROMs (2716, 27C256) sell to the retro market.

Related in ICs & chips

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